Shenzhen Liyang Welding Equipment Co., Ltd.
Main products:GBA Station,GBA Stencils,Solder Ball,Solder Plate
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  • Contact Person : Mr. Yang Michael
  • Company Name : Shenzhen Liyang Welding Equipment Co., Ltd.
  • Tel : 86-755-82976821
  • Address : Guangdong,shenzhen,room 1088, minzhi road
  • Country/Region : China

High-tech LY-X6(700A) bga rework station for all forms of bga encapsulation, excellent reballing machine

High-tech LY-X6(700A) bga rework station for all forms of bga encapsulation, excellent reballing machine
Product Detailed
1.optical alignment, reballing machine 2.Nitrogen system 3.IR+HR mixed 4.controlled by software 5.desolder and solder

 Hot sale LY-X6(750A) bga reballing machine

 

1. Product profile

LY-X6 is a small-sized rework station but can desolder and solder Max. PCB size 630x630mm; with optical alignment system and hot air & IR mixing heating way; controlled by software.

2. Features of LY-X6 reballing machine

Hot air head and mounting head integration design, with auto soldering and desoldering functions.

Upper/lower heaters adopt Hot air & IR mix heating. Upper heater uses two-path and direct-injection way. IR acts on the heating area directly; in the meanwhile, hot air works. They interact to heat quickly, and keep temperature even. (heating-up speed is up to 10°C/S)

Independent 3 heaters, upper and lower heaters can realize linkage and move within bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB, auto-controlled by motors. the upper and lower heater able to move towards target BGA, without moving PCB.

Unique bottom preheating table made of Germany-imported good quality heating  materials “plated IR tube” & constant temperature glass “anti-dazzle” (heat-resist up to 1800°C), pre-heating area up to 500*420mm.   

Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.

The unique design of integral movement in X/Y axis, make the best of space.; Small-sized device accomplishes big PCB rework needs ; Max. PCB size up to 630*610mm; no rework dead space.

Inbuilt vacuum pump, rotatable 360° in Φ angel; fine-adjusting mounting suction nozzle.

Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; “zero” pressure available to smaller BGA pickup and mounting.

Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 70*70MM;

Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed

Upper/lower heater with 10 segments of temperature up (down) and 10 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen. 

Many sizes of alloy nozzle, easy for replacement; can locate at all angle.

With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.

Equipped with two independent air supply, can connect with Nitrogen or compressor air, or interchange them, makes desoldering safer and more reliable.

Optional functions:

Can keep longtime 30°C difference between the heating area and border area to protect small BGA around from melting; special for the glued BGAs of cell phone and laptop.

Can upgrade to KID-R760 with the additional function of suction nozzle rotatable in 360°; controlled by step motor and the rotating angles can be memorized.

Can upgrade to KID-R780 with the additional function of suction nozzle rotatable in 360°, controlled by step motor and the rotating angles can be memorized; Optical alignment controlled by remote control motor; With auto-memory for BGA pickup & place and alignment; It can observe BGA four corners automatically.

 

3. Technical parameters

Model No.: LY-X6

Max. PCB size: W630*D610mm

PCB thickness: 0.5-5mm

Applicable BGA: 1*1 _ 70*70mm

Min. ball pitch: 0.15mm

 Max. weight of BGA: 150g

Placement precision: ±0.01mm

PCB locating way: Outer or location hole

Temperature control way: K-type thermocouple, close loop control

 Lower heater: IR+hot air 800W

Upper heater: Hot air 1200W

 Bottom pre-heating: IR 6000W

 Power: three-phrases 380V, 50/60Hz

Machine size: L970*W700*H830mm (exclude frame)

 Machine weight: Approx. 130KG

 

4. Standard accessories

Irregular jigs

Alloy hot air nozzles

2 barrier chip (reduce pre-heating area)

Paste flux

Solder balls

BGA Reball kits

Internal hexagonal wrench 

 

 

LY-X6 reballing machine

 

 

 Accept Alipay, West Union, TT, PayPal

High-tech LY-X6(700A) bga rework station for all forms of bga encapsulation, excellent reballing machine



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